Reltek BONDiT™ B-536 Adhesive System

Category	Polymer , Adhesive , Thermoset
Manufacturer	Reltek LLC
Trade Name	BONDiT™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Reltek BONDiT™ B-536 Adhesive System.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Key Properties: Very high strength bonding of dissimilar materials.High moisture and solvent resistance.Fast ambient cure with good pot life.Ease of use.Applications: Outstanding adhesive for very high strength potting and assembly applications. Bonds most plastics, metals, glass and ceramics. Good for electronics applications. High moisture resistance. Full cure 60 minutes at ambient or 10 minutes at 170º F or higher temperatures for faster cure down to 15 sec.

Physical Properties	Metric	English	Comments
Viscosity	2500 cP	2500 cP

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	51.15 MPa	7418 psi	Ambient Cure
Tensile Strength, Ultimate	53.04 MPa	7693 psi	Peak; Ambient Cure
Tensile Strength, Yield	53.04 MPa	7693 psi	Ambient Cure
Elongation at Break	9.2 %	9.2 %	Ambient Cure
Elongation at Yield	8.6 %	8.6 %	Ambient Cure

Processing Properties	Metric	English	Comments
Cure Time	60.0 min	1.00 hour	Ambient
Pot Life	45 min	45 min	Ambient

Descriptive Properties	Value	Comments
Color	Clear with slight amber

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