Polymer Property : Linear Mold Shrinkage, Flow = -0.000100 in/in Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Linear Mold Shrinkage, Flow	-0.000100 cm/cm	-0.000100 in/in	Compression molding; ISO 2577
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Linear Mold Shrinkage, Flow	-0.000100 cm/cm	-0.000100 in/in	Compression molding; ISO 2577
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Linear Mold Shrinkage, Flow	-0.000100 cm/cm	-0.000100 in/in	Compression molding; ISO 2577
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..