Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 80.0 - 110 cm | 31.5 - 43.3 in | 177°C/1000 psi |
Cookson Group Plaskon® S-7S Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically .. |
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Spiral Flow | 80.0 cm | 31.5 in | Cross Section: 7[mm]x3.5[mm]; AKRO |
Akro-Plastic Akromid® B3 GF 20 (2470) PA 6 Dry, 20% Glass Filled AKROMID® B (Polyamide 6) is an engineering compound, characterized by high mechanical strength, stiffness and thermal resistance. Furthermore, this polyamide offers high toughness at low temperatur.. |