Polymer Property : Spiral Flow = 35.4 in Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Spiral Flow	90.0 cm	35.4 in	175°C/1000 psi
Cookson Group Plaskon® LS-16S Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manuf..
Spiral Flow	90.0 cm	35.4 in	175°C/1000 psi
Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which mi..