Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 100 - 130 cm | 39.4 - 51.2 in | 177°C/1000 psi |
Cookson Group Plaskon® S-7P Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically .. |
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Spiral Flow | 100 cm @Thickness 1.00 mm |
39.4 in @Thickness 0.0394 in |
395°C nozzle, 200°C tool |
Victrex® PEEK 450CA20 Polyetheretherketone, 20% Carbon Fibre Reinforced Product Description:High performance thermoplastic material, 20% carbon fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, .. |