Polymer Property : Linear Mold Shrinkage, Transverse = 0.00050 in/in Product List

Physical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Physical Properties	Metric	English	Comments
Linear Mold Shrinkage, Transverse	0.00050 cm/cm	0.00050 in/in	Post-shrinkage, 150x105x3; 120Â°C; 4 hour; ISO 2577
Lanxess DurethanÂ® AKV 30 000000 Nylon 66, Glass Fiber Reinforced PA 66, 30% glass fibers, injection moldingInformation provided by LANXESS.
Linear Mold Shrinkage, Transverse	0.00050 cm/cm	0.00050 in/in	Post-shrinkage, 150x105x3; 120Â°C; 4 hour; ISO 2577
Lanxess DurethanÂ® BKV 50 000000 Nylon 6, Glass Fiber Reinforced PA 6, 50% glass fibers, injection moldingInformation provided by LANXESS.
Linear Mold Shrinkage, Transverse	0.00050 cm/cm	0.00050 in/in	Post-shrinkage, 60x60x2; 120Â°C; 4 hour; ISO 294-4
Lanxess DurethanÂ® AKV 40 H2.0 901510 Nylon 66, Glass Fiber Reinforced PA 66, 40% glass fibers, injection molding, heat-aging stabilizedInformation provided by LANXESS.
Linear Mold Shrinkage, Transverse	0.00050 - 0.0020 cm/cm @Time 86400 sec	0.00050 - 0.0020 in/in @Time 24.0 hour	ASTM D955
SABIC Innovative Plastics LNP THERMOCOMP DF00A8P PC (Asia Pacific) LNP* Thermocomp* DF00A8P is a compound based on Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include: High modulus, good flatness, good impact perform..
Linear Mold Shrinkage, Transverse	0.00050 - 0.0020 cm/cm @Time 86400 sec	0.00050 - 0.0020 in/in @Time 24.0 hour	ASTM D955
SABIC Innovative Plastics LNP THERMOCOMP D551 PC (Asia Pacific) LNP* Thermocomp* D551 (or DF00A8P) is a compound based on Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include: High modulus, good flatness, good impa..
Linear Mold Shrinkage, Transverse	0.00050 - 0.0020 cm/cm	0.00050 - 0.0020 in/in	ASTM D955
PolyOne Stat-Tech™ NJ-20CF/000 Black Polyamide 12 (Nylon 12) Stat-Tech™ Electrically Conductive Compounds are specifically engineered to provide anti-static, ESD and RFI/EMI shielding performance for critical electronic equipment applications. These compound..