Physical Properties | Metric | English | Comments |
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Viscosity | 16500 cP | 16500 cP | Part A, RVT, #6, 2.5 rpm; TM R050-12 |
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature.. |
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Viscosity | 16500 cP @Temperature 175 °C |
16500 cP @Temperature 347 °F |
Automatic orifice Viscosity |
Cookson Group Plaskon® 1002 Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea.. |
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Viscosity | 16500 cP @Temperature 25.0 °C |
16500 cP @Temperature 77.0 °F |
Mixed (lv #4, 12 rpm) |
Tra-Con Tra-Bond 723C01 One-Part Medical Grade Adhesive TRA-BOND 723C01 is a fast, heat curing, one component adhesive targeted at medical applications. The material complies with USP Class VI toxicity requirements and is resistant to gamma sterilization.. |
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Viscosity | 16500 - 18500 cP | 16500 - 18500 cP | uncured |
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p.. |