Polymer Property : Viscosity = 8500 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	8500 cP @Temperature 190 °C	8500 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 2585 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Ethylene copolymer and FDA compliantFeatures: Low softening point, excellent tack, excellent flexibility, long open time, and high viscosityApplications: Comp..
Viscosity	8500 cP @Temperature 190 °C	8500 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 3385 Amorphous Polyalphaolefin (APAO) Modified Bitumen Roofing Grade.Description: Ethylene copolymer and FDA compliantFeatures: High melt viscosity, balanced temperature resistance, and flexibilityApplications: Component of modified bit..
Viscosity	8500 cP	8500 cP	Part A, RVT, #4, 10 rpm; TM R050-12
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Viscosity	8500 cP @Temperature 175 °C	8500 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® S-7P Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically ..
Viscosity	8500 cP @Temperature 175 °C	8500 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® S-7S Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically ..
Viscosity	8500 cP @Temperature 175 °C	8500 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i..
Viscosity	8500 cP @Temperature 25.0 Â°C	8500 cP @Temperature 77.0 Â°F	Dynamic
Struktol VP 3643 Optimized elastomer-modified epoxy prepolymer Optimized elastomer-modified epoxy prepolymer for the flexibilisation of epoxy resin systemsApplications: STRUKTOL VP 3643 is used when conventional epoxy systems do not meet the requirements regard..
Viscosity	8500 cP @Temperature 25.0 °C	8500 cP @Temperature 77.0 °F
Esstech X-850-0000 Urethane Dimethacrylate Resin, C23H38O8 Urethane Dimethacrylates are often used in light-cure systems. The UDMA, cures to form a hard, glassy surface that is low in color and is considered bisphenol A free. Various urethane dimethacrylat..
Viscosity	8500 cP	8500 cP
Dymax 3070 Solvent-Free Plastic Adhesive Solvent-Free Adhesives for Plastic Assembly in SecondsDymax® Light-Weld® and Ultra 3000 Series UV and UV/Visible Curing Adhesives for plastic assembly provide instant durable bonds to cure a wide ..
Viscosity	8500 cP	8500 cP	Mixed Viscosity
Aremco Aremco-Bond™ 526N High Performance Epoxide Clear-Amber, 1:1 System for Tough Bonding Applications Also available filled with aluminum oxide (Alumina) or pigments
Viscosity	8500 cP @Temperature 177 °C	8500 cP @Temperature 350 °F	Typical
Bostik 2128 Clear, Light Assembly EVA Glue Stick Bostik 2128 Clear, Light Assembly EVA Glue StickClear for light assembly.
Viscosity	8500 cP	8500 cP
Resinlab® RC8020 Anaerobic Retaining Compound The RC 8000 Series anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products ..
Viscosity	8500 cP @Temperature 190 °C	8500 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 3585 Amorphous Polyalphaolefin (APAO) Modified Bitumen Roofing Grade.Description: Ethylene copolymer and FDA compliantFeatures: High melt viscosity and excellent low temperature flexibilityApplications: Component of modified bitumen roo..
Viscosity	8500 - 22000 cP	8500 - 22000 cP	Thixotropic
Loctite® 620 High Temperature Retaining Compound RetainersLoctite Corporation, the pioneer of anaerobic adhesives, has applied this technology to create retaining compounds that increase the shear strength of cylindrical, non-threaded assemblies. ..
Viscosity	8500 cP @Temperature 190 °C	8500 cP @Temperature 374 °F	melt viscosity; ASTM D 3236
REXtac Rextac® RT 2385 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Ethylene copolymer and FDA compliantFeatures: Balance of heat resistance, flexibility, stiffness, high viscosity, and medium open timeApplications: Component ..