Polymer Property : Thickness = 0.0187 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	0.475 - 0.676 microns	0.0187 - 0.0266 mil	2000-4000 rpm
Dow SiLK™ I 550 Semiconductor Dielectric Resin SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with..