Polymer Property : Thickness = 0.0220 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	0.560 - 0.790 microns	0.0220 - 0.0311 mil	2000-4000 rpm
Dow SiLK™ I 620 Semiconductor Dielectric Resin SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with..
Thickness	0.560 microns	0.0220 mil	3000 rpm
Dow SiLK™ I300 560 Semiconductor Dielectric Resin SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl..