Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.720 - 1.02 microns | 0.0283 - 0.0402 mil | 2000-4000 rpm |
Dow SiLK™ I 820 Semiconductor Dielectric Resin SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with.. |