Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.360 microns | 0.0142 mil | 3000 rpm |
Dow SiLK™ I 360 Semiconductor Dielectric Resin SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with.. |