Polymer Property : Thickness = 7.01 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	178 microns	7.01 mil
Parker Chomerics CHO-BOND® 1121 General Purpose Adhesive-Sealant Silver Silicone Description: Xylene-free version of CHO-BOND 1038; rec. bond line thickness: > 0.18 mm; primer promotes adhesion CHO-BOND® 1121 is an electrically conductive, one-component silicone adhesive-sealan..
Thickness	178 microns	7.01 mil
Parker Chomerics Tecknit® 0002 Highly Conductive Adhesive-Sealant Silver Silicone Description: TECKNIT® 0002 is a pure silver filled, one component RTV silicone adhesive-sealant. It is ready to use without mixing and cures quickly at room temperature on exposure to moisture in ..
Thickness	178 microns	7.01 mil	Thermal Conductor
Parker Chomerics T-Wings Heat Spreaders Description: Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate. T-Wing spreade..