Physical Properties | Metric | English | Comments |
---|---|---|---|
Storage Temperature | 0.000 - 4.44 °C | 32.0 - 40.0 °F | Film and Liquid |
Hexcel® Redux® 775 Vinyl phenolic structural adhesive Redux 775 was adopted as the world's first metal-to-metal bonding process to be officially approved for use in the manufacture of aircraft primary structures in 1943. It is available either as a fil.. |