Polymer Property : Ionic Impurities - Cl (Chloride) = 200 ppm Product List

Chemical Properties

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Chemical Properties	Metric	English
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..