Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength | >= 1.88 MPa | >= 273 psi | |
Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer This is the small particle version of the Ag/glass (FIP E) compound that was specifically designed for the mobile cell phone applications. It should be noted that this compound offers a low compress.. |
|||
Tensile Strength | >= 1.88 MPa | >= 273 psi | |
Parker Chomerics Tecknit Teckfip™ FIP-E Formed in Place Conductive Elastomer Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value. The material is also available as a h.. |