Mechanical Properties | Metric | English | Comments |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic.. |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20.. |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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Compressive Strength | 225 MPa @Temperature 23.0 °C |
32600 psi @Temperature 73.4 °F |
EN ISO 604 |
Ensinger TECASINT 3022 Polyimide, Black, 15% Graphite (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p.. |
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Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 |
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-.. |