Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Compressive Modulus | 5.86 GPa | 850 ksi | TM R050-38 |
Resinlab® EP1330LV Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application.. |