Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Compressive Yield Strength | 16.0 MPa @Temperature 100 °C |
2320 psi @Temperature 212 °F |
Dry,Cure cycle: 5 days at 22°C; ASTM D695 |
Hexcel® Redux® 830 Two-Part Epoxy Syntactic Paste Adhesive Redux® 830 is a low density, self-extinguishing, syntactic, room temperature curing, two-part, epoxy paste adhesive. Redux® 830 is supplied as a 1.5 working kit.Features: Low density; Self-extingu.. |