Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength at Break | 79.6 MPa @Temperature 200 °C |
11500 psi @Temperature 392 °F |
ISO 527-2 |
Solvay Specialty Polymers Amodel® A-4160 HSL Polyphthalamide (PPA)
(Unverified Data**) Amodel A-4160 HSL resin is a 60% glass reinforced, heat stabilized polyphthalamide (PPA) which exhibits high modulus at elevated temperatures, a high heat deflection temperature and exceptional cree.. |
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Tensile Strength at Break | 79.3 MPa @Temperature 175 °C |
11500 psi @Temperature 347 °F |
ISO 527-2 |
Solvay Specialty Polymers Amodel® AS-4133 HS Polyphthalamide (PPA)
(Unverified Data**) Amodel AS-4133 HS is a 33% glass reinforced, lubricated, heat stabilized grade of polyphthalamide (PPA) that offers fast cycle times and moldability in hot water molds. Typical applications include .. |
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Tensile Strength at Break | 79.6 MPa @Temperature 200 °C |
11500 psi @Temperature 392 °F |
2; ISO 527-2 |
Solvay Specialty Polymers Amodel® A-4160 HSL Polyphthalamide (PPA), 60% Glass Fiber Amodel® A-4160 HSL resin is a 60% glass reinforced, heat stabilized polyphthalamide (PPA) which exhibits high modulus at elevated temperatures, a high heat deflection temperature and exceptional .. |
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Tensile Strength at Break | 79.3 MPa @Temperature 175 °C |
11500 psi @Temperature 347 °F |
4; ISO 527-2 |
Solvay Specialty Polymers Amodel® AS-4133 HS Polyphthalamide (PPA), 33% Glass Fiber (Dry) Amodel® AS-4133 HS is a 33% glass reinforced, lubricated, heat stabilized grade of polyphthalamide (PPA) that offers fast cycle times and moldability in hot water molds. Testing conducted on samp.. |
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Tensile Strength at Break | 79.3 MPa @Temperature 175 °C |
11500 psi @Temperature 347 °F |
ISO 527-2 |
Solvay Specialty Polymers Amodel® AS-4133 HN Polyphthalamide (PPA), Dry, 33% Glass Fiber Reinforcement, Heat Stabilizer Amodel AS-4133 HN polyphthalamide (PPA) is a non-lubricated, heat stabilized grade that offers fast cycle times and is hot-water moldable. Typical applications include electrical and electronic comp.. |