Polymer Property : Tensile Modulus = 222 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	1.53 GPa	222 ksi	Storage
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Tensile Modulus	1.53 GPa	222 ksi	Storage
Epoxy Technology EPO-TEK® OG142 UV Cure Optical Epoxy Material Description: A single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientif..
Tensile Modulus	1.53 GPa	222 ksi	1 mm/min
Arkema Group Rilsan® BMF Nylon 11 (Dry) Designation ISO 1874-PA11,M,12-010Rigid grade for injection molding. Available color: natural. Additive free.Good melt viscosity. Outstanding ability to mold part with high length-thickness ratio an..
Tensile Modulus	1.53 GPa	222 ksi	1 mm/min
Arkema Group Rilsan® MB 3750 Nylon 11, Transparent Grade (Conditioned) Designation ISO 1874-PA11/xx,F,THL,22-020Transparent semi-crystalline PA11 grade.Used for film extrusion and injection molding (low thickness).Very good low temperature impact strength.High chemical..