Mechanical Properties | Metric | English | Comments |
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Shear Strength | 62.0 MPa | 8990 psi | Die |
Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |
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Shear Strength | 62.0 MPa | 8990 psi | Die |
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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Shear Strength | 62.0 MPa | 8990 psi | ASTM D732 |
Unitika M1030B PA6, Dry Nano composite nylonInformation provided by Unitika Ltd. |