Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Shear Strength | 64.98 MPa | 9425 psi | Die |
Lord Adhesives Thermosetâ„¢ ME-525 Underfill Encapsulant LORD Thermosetâ„¢ ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |