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Polymer Property : CTE, linear, Transverse to Flow = 66.3 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear, Transverse to Flow 66.3 µm/m-°C

@Temperature 20.0 °C
36.8 µin/in-°F

@Temperature 68.0 °F
Cookson Group Plaskon® LS-16S Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manuf..
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