Polymer Property : CTE, linear = 180 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	180 µm/m-°C @Temperature >=61.0 °C	100 µin/in-°F @Temperature >=142 °F	above Tg
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..
CTE, linear	180 µm/m-°C @Temperature 100 - 150 °C	100 µin/in-°F @Temperature 212 - 302 °F	ASTM E831-00
DSM Somos® 14120 Water-resistant resin for stereolithography, White DescriptionDSM Somos® 14120 is a low viscosity liquid photopolymer that produces strong, tough, water-resistant parts. Parts created with Somos® 14120 have a white, opaque appearance similar to p..
CTE, linear	180 µm/m-°C @Temperature 70.0 - 140 °C	100 µin/in-°F @Temperature 158 - 284 °F
3D Systems Accura® Xtreme White 200 Plastic Ultra tough white plastic to replace CNC Machined polypropylene and ABS articles FeaturesExceptionally tough and durableUsed for challenging functional assembliesUsed for snap fit assembl..
CTE, linear	180 µm/m-°C @Temperature 50.0 - 160 °C	100 µin/in-°F @Temperature 122 - 320 °F	DIN 53122
Arkema Group ORGASOL® 3502 D Nat 1 Copolyamide 6/12 Information provided by Arkema Group
CTE, linear	180 µm/m-°C @Temperature 60.0 - 125 °C	100 µin/in-°F @Temperature 140 - 257 °F	Above Tg
3M Scotch-Weld™ DP270 Black Structural Adhesive Rigid potting compound, Non-corrosiveInformation provided by 3M
CTE, linear	180 µm/m-°C @Temperature 60.0 - 125 °C	100 µin/in-°F @Temperature 140 - 257 °F	Above Tg
3M Scotch-Weld™ DP270 Clear Structural Adhesive Rigid potting compound, Non-corrosiveInformation provided by 3M
CTE, linear	180 µm/m-°C @Temperature >=112 °C	100 µin/in-°F @Temperature >=234 °F	above Tg
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
CTE, linear	180 µm/m-°C @Temperature >=112 °C	100 µin/in-°F @Temperature >=234 °F	above Tg
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
CTE, linear	180 µm/m-°C @Temperature >=61.0 °C	100 µin/in-°F @Temperature >=142 °F	above Tg
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..