Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 21.0 µm/m-°C @Thickness 0.102 mm, Temperature 0.000 - 150 °C |
11.7 µin/in-°F @Thickness 0.00400 in, Temperature 32.0 - 302 °F |
Y-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material SYRON™ 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7100 is thermally stable, with a .. |
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CTE, linear | 21.0 µm/m-°C @Temperature 0.000 - 140 °C |
11.7 µin/in-°F @Temperature 32.0 - 284 °F |
X-, Y-Direction; ASTM D3386 |
Rogers Corporation TMM® TMM10 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope.. |
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CTE, linear | 21.0 µm/m-°C @Temperature 0.000 - 140 °C |
11.7 µin/in-°F @Temperature 32.0 - 284 °F |
Z-Direction; ASTM D3386 |
Rogers Corporation TMM® TMM4 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope.. |
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CTE, linear | 21.0 µm/m-°C @Temperature 0.000 - 150 °C |
11.7 µin/in-°F @Temperature 32.0 - 302 °F |
Y-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81.. |
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CTE, linear | 21.0 µm/m-°C @Temperature 100 - 200 °C |
11.7 µin/in-°F @Temperature 212 - 392 °F |
Axial; ASTM E831 |
Solvay Specialty Polymers Ryton® R-4 Polyphenylene Sulfide Compound
(Unverified Data**) Natural Color Polyphenylene Sulfide CompoundRyton® R-4 is a 40% fiberglass reinforced polyphenylene sulfide compound which provides outstanding chemical resistance and mechanical properties even at.. |
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CTE, linear | 21.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
11.7 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Solvay Specialty Polymers Ryton® R-4 Polyphenylene Sulfide Compound
(Unverified Data**) Natural Color Polyphenylene Sulfide CompoundRyton® R-4 is a 40% fiberglass reinforced polyphenylene sulfide compound which provides outstanding chemical resistance and mechanical properties even at.. |
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CTE, linear | 21.0 µm/m-°C @Temperature 100 - 200 °C |
11.7 µin/in-°F @Temperature 212 - 392 °F |
Axial; ASTM E831 |
Solvay Specialty Polymers Ryton® R-4 02 Polyphenylene Sulfide Compound
(Unverified Data**) Black Polyphenylene Sulfide CompoundRyton® R-4 02 is a 40% fiberglass reinforced polyphenylene sulfide compound which provides outstanding chemical resistance and mechanical properties even at elev.. |
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CTE, linear | 21.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
11.7 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Solvay Specialty Polymers Ryton® R-4 02 Polyphenylene Sulfide Compound
(Unverified Data**) Black Polyphenylene Sulfide CompoundRyton® R-4 02 is a 40% fiberglass reinforced polyphenylene sulfide compound which provides outstanding chemical resistance and mechanical properties even at elev.. |
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CTE, linear | 21.0 µm/m-°C @Temperature 0.000 - 100 °C |
11.7 µin/in-°F @Temperature 32.0 - 212 °F |
y direction; IPC TM-650 2.4.24 |
Arlon DiClad 522/527 PTFE/Woven Fiberglass Laminates DiClad 522 and DiClad 527 use a higher fiberglass/PTFE ratio to provide mechanical properties approaching conventional substrates.Extremely Low Loss TangentExcellent Dimensional StabilityProduct Per.. |