Polymer Property : CTE, linear = 68.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	68.0 µm/m-°C @Temperature 0.000 - 150 °C	37.8 µin/in-°F @Temperature 32.0 - 302 °F	Z-Direction; IPC-TM-650 2.1.41
Rogers Corporation Syron™ 7000 Thermoplastic Circuit Material SYRON™ 7000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7000 is thermally stable, with a ..
CTE, linear	68.0 µm/m-°C @Temperature 0.000 - 150 °C	37.8 µin/in-°F @Temperature 32.0 - 302 °F	Z-Direction; IPC-TM-650 2.1.41
Rogers Corporation XT/duroid™ 8000 Thermoplastic Laminate, Circuit Material XT/duroid™ 8000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8000 circuit materials ar..
CTE, linear	68.0 µm/m-°C @Temperature 20.0 - 80.0 °C	37.8 µin/in-°F @Temperature 68.0 - 176 °F	DIN 53752
Propex Fabrics Curv™ C100A Polypropylene/Polypropylene Thermoformable Composite Curv™ key features include weight savings, total recyclability, no glass content, thermoformable, high impact strength, inertness, and abrasion resistance.Data provided by BP Amoco; Curv was spun o..
CTE, linear	68.0 µm/m-°C @Temperature 150 - 220 °C	37.8 µin/in-°F @Temperature 302 - 428 °F	Alpha 2; TMA
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low..