Thermal Properties | Metric | English | Comments |
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UL RTI, Mechanical without Impact | 190 °C | 374 °F | |
Rogers Corporation Ultralam® 3850 Liquid Crystalline Polymer Circuit Material ULTRALAM® 3850 laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film.Features & Benefits:Excellent high frequency propertiesStable .. |
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UL RTI, Mechanical without Impact | 190 °C | 374 °F | |
Rogers Corporation Ultralam® 3908 Liquid Crystalline Polymer Circuit Material ULTRALAM® 3908 bondply is used as a bonding medium between copper and the dielectric material. This product was developed specifically for multi-layer substrate constructions. This adhesiveless f.. |
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UL RTI, Mechanical without Impact | 190 °C @Thickness 1.57 mm |
374 °F @Thickness 0.0618 in |
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Solvay Specialty Polymers Veradel® AG-230 Polyethersulfone
(discontinued **) For superior long-term performance at high temperatures in severe service environments. It offers especially good toughness, hydrolytic stability, chemical resistance, plus FDA and USDA compliance.N.. |