Thermal Properties | Metric | English | Comments |
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Decomposition Temperature | 344 °C | 651 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
Park Electrochemical Nelco® N5000-30/32 BT Epoxy Package The Nelco N5000-30 prepreg and N5000-32 laminate BT epoxy materials are designed specifically to meet or exceed new and emerging chippackaging requirements. The primary applications of these materia.. |
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Decomposition Temperature | 344 °C | 651 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th.. |