Polymer Property : Decomposition Temperature = 585 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	307 °C	585 °F	Degradation Temperature
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..