Polymer Property : Decomposition Temperature = 667 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	353 °C	667 °F	Degradation Temperature
Epoxy Technology EPO-TEK® OG133-8 UV Cure Optical Epoxy Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and ..
Decomposition Temperature	353 °C	667 °F	Onset; IPC TM-650 2.4.24.6
Arlon 33N Polyimide Laminate and Prepreg High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with fla..