Polymer Property : Decomposition Temperature = 732 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	389 °C	732 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for..
Decomposition Temperature	389 °C	732 °F	Degradation Temperature
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Decomposition Temperature	389 °C	732 °F	5 percent; IPC TM-650 2.4.24.6
Arlon 33N Polyimide Laminate and Prepreg High reliability and high temperature material33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with fla..