Thermal Properties | Metric | English | Comments |
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CTE, linear | 5.04 µm/m-°C @Temperature 20.0 °C |
2.80 µin/in-°F @Temperature 68.0 °F |
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SGL Carbon Group EK 2200 Carbon Graphite Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and.. |
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CTE, linear | 5.04 µm/m-°C @Temperature 20.0 °C |
2.80 µin/in-°F @Temperature 68.0 °F |
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SGL Carbon Group EK 2243 Carbon Graphite Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and.. |
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CTE, linear | 5.04 µm/m-°C @Temperature 20.0 °C |
2.80 µin/in-°F @Temperature 68.0 °F |
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SGL Carbon Group EK 3235 Carbon Graphite Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and.. |
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CTE, linear | 5.04 µm/m-°C @Temperature 23.9 - 260 °C |
2.80 µin/in-°F @Temperature 75.0 - 500 °F |
ASTM E831 |
Saint-Gobain Meldin® 7211 Isostatically Molded Graphite and PTFE Filled Polyimide Finished parts and basic shapes made from 10% by weight PTFE and 15% by weight graphite filled polyimide material for applications requiring a very low coefficient of friction and self-lubricating p.. |
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CTE, linear | 5.04 µm/m-°C @Temperature 20.0 °C |
2.80 µin/in-°F @Temperature 68.0 °F |
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Aremco Ceramacast™ 900 High Temperature Potting & Casting Material Zirconia Silicate High Density, high strength molding compound. |
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CTE, linear | 5.04 µm/m-°C | 2.80 µin/in-°F | |
Touchstone CFOAM® 30 Structural Carbon Foam CFOAM, developed by Touchstone Research Laboratory, Ltd., is a next generation structural material which is inexpensive, lightweight, fire-resistant, impact-absorbing, and which can be thermally ins.. |
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CTE, linear | 5.04 µm/m-°C | 2.80 µin/in-°F | |
Touchstone CFOAM® 20 Structural Carbon Foam CFOAM, developed by Touchstone Research Laboratory, Ltd., is a next generation structural material which is inexpensive, lightweight, fire-resistant, impact-absorbing, and which can be thermally ins.. |