Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 0.890 W/m-K | 6.18 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i.. |