Polymer Property : Thermal Conductivity = 215 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	215 W/m-K	1490 BTU-in/hr-ft²-°F
Plansee MoCu40 Molybdenum-Copper Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, among others.Information provided by Plans..
Thermal Conductivity	215 W/m-K	1490 BTU-in/hr-ft²-°F	greater than pure W
Plansee W-15Cu Tungsten-Copper Composite This composite material is composed of a porous tungsten matrix which is infiltrated with copper.Characteristics:Very resistant to arc erosionGood electrical conductivityHigh thermal conductivityLow..