Polymer Property : Thermal Conductivity = 3.26 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.470 W/m-K	3.26 BTU-in/hr-ft²-°F	ASTM E1225
Proto3000 Duraform® GF Selective Laser Sintering (SLS®) Prototyping Polymer Description: Glass-filled polyamide (nylon) material for real-world physical testing and functional useFeatures:Excellent mechanical stiffnessElevated temperature resistanceDimensionally stableEasy-..
Thermal Conductivity	0.470 W/m-K	3.26 BTU-in/hr-ft²-°F	ASTM E1461-92
Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free ..
Thermal Conductivity	0.470 W/m-K	3.26 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 50-7078/GY Polycarbonate, with carbon fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.Strong, stiff parts.Electrically conductive, suitable for cont..
Thermal Conductivity	0.470 - 0.490 W/m-K	3.26 - 3.40 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Solvay Specialty Polymers PolidanÂ® T/A Polyethylene, Crosslinked (XLPE) POLIDANÂ® T/A is a silane crosslinkable PE compound which is used together with a catalyst masterbatch to accelerate the crosslinking reaction. It is used for flexible crosslinkable pipes.Features..
Thermal Conductivity	0.470 - 0.490 W/m-K	3.26 - 3.40 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Solvay Specialty Polymers PolidanÂ® T/A-SP Polyethylene, Crosslinked (XLPE) POLIDANÂ® T/A-SP is a silane crosslinkable PE compound which is used together with a catalyst masterbatch to accelerate the crosslinking reaction. It is used for flexible crosslinkable pipes.Featu..
Thermal Conductivity	0.470 W/m-K @Temperature 100 °C	3.26 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 3509 Phenolic, Granular, Compression Molded PLENCO 03509 is a mineral and flock filled phenolic molding compound offering excellent electrical properties, dimensional stability, and improved heat resistance. UL recognized under component file..
Thermal Conductivity	0.470 W/m-K @Temperature 100 °C	3.26 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 4349 Phenolic, Granular, Injection Molded PLENCO 04349 is a heat resistant, mineral filled phenolic molding compound offering optimized cure characteristics, and excellent heat resistant properties. PLENCO 04349 is also formulated to offer ..
Thermal Conductivity	0.470 W/m-K	3.26 BTU-in/hr-ft²-°F	ASTM E1225
3D Systems DuraForm® GF Glass Filled Nylon For use with all selective laser sintering (SLS®) systems.ApplicationsHousings and enclosuresConsumer sporting goodsAppropriate for low- to mid-volume rapid manufacturingParts requiring machining o..