Polymer Property : Liquidus = 300 Â°C Product List

Thermal Properties

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Thermal Properties	Metric	English
Liquidus	300 Â°C	572 Â°F
Indium Corp. Indalloy 160 Tin Solder Alloy Information Provided by Indium Corporation
Liquidus	300 Â°C	572 Â°F
Johnson Matthey JM No2S Soft Solder Flux A liquid non-corrosive flux for use on copper and brass. The residues are water soluble and non-corrosive, however it is recommended they are removed to prevent any possibility of contamination aft..
Liquidus	300 °C	572 °F
Williams Advanced Alloys WS300 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
Liquidus	300 °C	572 °F
Johnson Matthey JM R-Core Soft Solder Flux A "rosin" type core generally used for joining copper and brass. Residues are non-corrosive.Information provided by Johnson Matthey.