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- Polymer Property : CTE, linear, Parallel to Flow = 15.1 µin/in-°F
Polymer Property : CTE, linear, Parallel to Flow = 15.1 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature 40.0 - 120 °C |
15.1 µin/in-°F @Temperature 104 - 248 °F |
ASTM E 831 |
| SABIC Innovative Plastics LNP KONDUIT PX08322 PA 6 LNP* Konduit* PX08322 is a compound based on PA6 resin containing mineral. Added features include: Thermally Conductive, Flame Retardant |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature 40.0 - 120 °C |
15.1 µin/in-°F @Temperature 104 - 248 °F |
ASTM E 831 |
| SABIC Innovative Plastics LNP KONDUIT PX08322 PA 6 (Asia Pacific) Thermally conductive mineral filled PA6 FR compound |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
| SABIC Innovative Plastics LNP THERMOCOMP DC006ER PC LNP THERMOCOMP* DC006ER is a compound based on Polycarbonate resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding, Mold Release, Electrically Conductive. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
| SABIC Innovative Plastics LNP THERMOCOMP DC006ER PC LNP THERMOCOMP* DC006ER is a compound based on Polycarbonate resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding, Mold Release, Electrically Conductive. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
| SABIC Innovative Plastics LNP THERMOCOMP DC006ER PC (Asia Pacific) LNP THERMOCOMP* DC006ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
| SABIC Innovative Plastics LNP THERMOCOMP DC006ER PC (Asia Pacific) LNP THERMOCOMP* DC006ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
| SABIC Innovative Plastics LNP STAT-KON DE006ER PC LNP STAT-KON* DE006ER is a compound based on Polycarbonate resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding. Mold Release, Electrically Conductive. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
| SABIC Innovative Plastics LNP STAT-KON DE006ER PC LNP STAT-KON* DE006ER is a compound based on Polycarbonate resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding. Mold Release, Electrically Conductive. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
| SABIC Innovative Plastics LNP STAT-KON DE006ER PC (Asia Pacific) LNP STAT-KON* DE006ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding. |
|||
| CTE, linear, Parallel to Flow | 27.1 µm/m-°C @Temperature -40.0 - 40.0 °C |
15.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
| SABIC Innovative Plastics LNP STAT-KON DE006ER PC (Asia Pacific) LNP STAT-KON* DE006ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding. |
|||
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