Polymer Property : Pot Life = 40320 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	40320 min @Temperature 25.0 Â°C	40320 min @Temperature 77.0 Â°F
Lord Adhesives Circalokâ„¢ EP-729 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by..
Pot Life	40320 min @Temperature 25.0 Â°C	40320 min @Temperature 77.0 Â°F
Lord Adhesives Circalokâ„¢ EP-937 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by..
Pot Life	40320 min @Temperature 25.0 Â°C	40320 min @Temperature 77.0 Â°F
Lord Adhesives Circalokâ„¢ EP-939 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® B9021 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Pot Life	40320 min	40320 min	Closed container
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® ED1020 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include exce..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
Pot Life	40320 min	40320 min
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..