Polymer Property : Pot Life = 50.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	50.0 min @Temperature 25.0 °C	50.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) FR-1046 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	50.0 min @Temperature 25.0 °C	50.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) FR-1046 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	50.0 min @Temperature 25.0 °C	50.0 min @Temperature 77.0 °F	0.5 lbm
Cytec EN-11 (Conap) Casting, Potting, and Molding Compound High Technology Potting, Casting and Molding CompoundsTwo-component, polybutadiene-based liquid urethane casting and potting systems. When reacted these high technology systems produce tough, stable..
Pot Life	50.0 min @Temperature 23.9 °C	50.0 min @Temperature 75.0 °F
Devcon Carbide Putty Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives.
Pot Life	50.0 min	50.0 min	uncured
Atom Adhesives AA-BOND FDA26 Epoxy Adhesive AA-BOND FDA26 is Versatile adhesive guaranteed a high strength bond. AA-BOND FDA26 is two part adhesive used and cured at room temperature for bonding, repair applications by manufacturers of food p..