Polymer Property : Pot Life = 75.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	75.0 min @Temperature 25.0 °C	75.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) FR-1047 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	75.0 min	75.0 min	uncured
Atom Adhesives AA-BOND FS227 Epoxy Adhesive AA-BOND FS227 is a thixotropic polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, a..