Processing Properties | Metric | English | Comments |
---|---|---|---|
Gel Time | 15.0 - 20.0 min @Temperature 50.0 °C |
15.0 - 20.0 min @Temperature 122 °F |
|
Hexcel® Redux® 830 Two-Part Epoxy Syntactic Paste Adhesive Redux® 830 is a low density, self-extinguishing, syntactic, room temperature curing, two-part, epoxy paste adhesive. Redux® 830 is supplied as a 1.5 working kit.Features: Low density; Self-extingu.. |