Processing Properties | Metric | English | Comments |
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Cure Time | 4.00 min @Temperature 150 °C |
0.0667 hour @Temperature 302 °F |
Hot Plate |
Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu.. |
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Cure Time | 4.00 min @Temperature 75.0 °C |
0.0667 hour @Temperature 167 °F |
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Gwent Electronic Materials C2050905D3 80:20 Silver Palladium Ink C2050905D3 is an ink based on a 80:20 ratio of Silver:Palladium; a screen printing internal electrode ink for flexible PZT components. This Material is compatible with PVB tape. The ink is designed .. |
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Cure Time | 4.00 min @Temperature 150 °C |
0.0667 hour @Temperature 302 °F |
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Dow Corning 3-4130 DIELECTRIC GEL KIT Two-part, clear, heat cure, low extractables.Information provided by Dow Corning |
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Cure Time | 4.00 min @Temperature 150 °C |
0.0667 hour @Temperature 302 °F |
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Dow Corning 3-4190 SILICONE GEL KIT Two-part, transparent green, RT or heat cure, low viscosity, long shelf life.Information provided by Dow Corning |
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Cure Time | 4.00 min @Temperature 204 °C |
0.0667 hour @Temperature 399 °F |
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3M Scotchcast™ 5555 22G Electrical Insulating Epoxy Resin 3M Scotchcast Electrical Resin 5555 is a one-part, green pigmented, rapid heat curing powder coating. It is designed to provide a continuous, tough moisture and chemical resistant dielectric coating.. |
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Cure Time | 4.00 min @Temperature 232 °C |
0.0667 hour @Temperature 450 °F |
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3M Scotchkote™ 206N Fusion Bonded Epoxy Coating (Fluid Bed Grade) 3M Scotchkote Fusion-Bonded Epoxy Coating 206N (Fluid Bed Grade) is a one-part, heat curable, thermosetting epoxy coating designed for corrosion protection of metal. The epoxy is applied to preheate.. |