Polymer Property : Dry Time = 24.0 hour Product List

Processing Properties

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Processing Properties	Metric	English
Dry Time	<= 24.0 hour	<= 24.0 hour
Epoxy Technology EPO-TEK® B9021 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Dry Time	<= 24.0 hour	<= 24.0 hour
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Dry Time	<= 24.0 hour	<= 24.0 hour
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Dry Time	<= 24.0 hour	<= 24.0 hour
Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..