Processing Properties | Metric | English | Comments |
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Gel Time | 3.50 - 5.80 min @Temperature 150 °C |
3.50 - 5.80 min @Temperature 302 °F |
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Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with .. |