Dyna-Purge® SF Purging Compound

Designed for Sheet & Profile Co-Extrusion & Multi-Layer FilmGeneral Description:DYNA-PURGE SF is a non-abrasive, non-chemical “engineered” thermoplastic purging compound, with a proprietary foaming agent, which allows the purge to expand and scrub the screw and barrel, die, and other downstream equipment. The material is designed for extruders and co-extruders that have limited clearances related to screenpacks, mixing or metering devices, etc., when processing sheet, profile, and single or multi-layer blown film.FEATURES & BENEFITS OF DYNA-PURGE SFExcellent for color changes, resin changes, preventative machine maintenance, and before manual cleaningIdeal for use when screen packs can’t be removed from the extruder, when the die head has clearance of less than .025 inch (.65 mm), or for when there are metering and mixing devicesEffective through a wide temperature range 320°F-575°F(160°C-302°C)Easy to use – no process adjustment necessary – use at the resident resin processing temperature and RPM speedNon-abrasive thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the systemSafe, non-hazardous, with no chemicals – ingredients are FDA compliantHeat stable – recommended during shutdown and start-upLow “cost-per-purge” – only small quantity needed to be effectiveNo mixing required – simply use “as is”Unlimited shelf life