Lord Adhesives Metech 3571 Silver Conductor Composition

Category	Polymer , Adhesive
Manufacturer	Lord Adhesives
Trade Name	Metech
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Metech 3571 Silver Conductor Composition.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

This high performance silver conductor is designed for cost sensitive hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film that is resistant to solder leaching. It also exhibits excellent adhesion to beryllium oxide substrates.All information provided by Lord.

Physical Properties	Metric	English	Comments
Brookfield Viscosity	170000 - 200000 cP @Temperature 25.0 Â°C	170000 - 200000 cP @Temperature 77.0 Â°F	HBT, Spindle #SC4-14 @ 10rpm
Thickness	11.0 - 13.0 microns	0.433 - 0.512 mil	Fired

Electrical Properties	Metric	English	Comments
Surface Resistivity per Square	<= 0.0015 ohm	<= 0.0015 ohm

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature 25.0 Â°C	12.0 Month @Temperature 77.0 Â°F

Descriptive Properties	Value	Comments
Adhesion	3-4	lbs; aged (500hrs. at 150ÂºC)
	6-8	lbs; initial
Coverage (cmÂ²/gm)	70-75	Calculated from 50 micron wet film
Line Resolution (microns)	125
Solder Leach Resistance (cycles)	5	Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ÂºC
Solder Wetting (seconds)	< 3	Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ÂºC

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