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Parker Chomerics CHO-FOIL CCK Shielding Tape

Category Polymer , Adhesive , Tape
Manufacturer Parker Chomerics
Trade Name CHO-FOIL
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-FOIL CCK Shielding Tape.pdf
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Material Notes:
Conductive Adhesive Tin-plated Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive.Typical Applications: Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell; EMI radiation measurement troubleshooting, using CHO-FOIL tape to shield ventilation slots or seam gaps; Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures; Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum; EMI shield for cables by wrapping the tape around the cable. An overlap is recommended; ESD shielding; Provide corrosion-resistant ground contact points; Fabric tape available where weight and flexibility are important, such as for wrapping cables. Information provided by Chomerics
Physical Properties Metric English Comments
Thickness 38.1 microns
1.50 mil
Adhesive thickness
40.6 microns
1.60 mil
Foil thickness
78.7 microns
3.10 mil
Total
Mechanical Properties Metric English Comments
Peel Strength 0.508 kN/m
2.90 pli
ASTM D1000
0.859 kN/m

@Temperature 85.0 °C
4.90 pli

@Temperature 185 °F
95% RH; ASTM D1000
0.561 kN/m

@Temperature 121 °C,
Time 605000 sec
3.20 pli

@Temperature 250 °F,
Time 168 hour
ASTM D1000
0.736 kN/m

@Temperature 85.0 °C,
Time 605000 sec
4.20 pli

@Temperature 185 °F,
Time 168 hour
ASTM D1000
0.841 kN/m

@Time 605000 sec
4.80 pli

@Time 168 hour
Salt fog corrosion; ASTM D1000
Taber Abrasion, mg/1000 Cycles <= 6.0
<= 6.0
500 gramweight. CS-10 wheel, 500 cycles; CHO-TP-57
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 205 °C
401 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Electrical Properties Metric English Comments
Surface Resistance <= 0.0020 ohm
<= 0.0020 ohm
Initial Surface Resistivity (SR); CHO-TP-57
<= 0.0020 ohm
<= 0.0020 ohm
Initial through resistivity (TR); CHO-TP-57
<= 0.0090 ohm
<= 0.0090 ohm
Initial Taber Abrasion; CHO-TP-57
<= 0.0020 ohm

@Temperature 85.0 °C
<= 0.0020 ohm

@Temperature 185 °F
95% RH; (SR); CHO-TP-57
<= 0.0020 ohm

@Temperature 85.0 °C
<= 0.0020 ohm

@Temperature 185 °F
95% RH; (TR); CHO-TP-57
<= 0.0020 ohm

@Temperature 85.0 °C,
Time 605000 sec
<= 0.0020 ohm

@Temperature 185 °F,
Time 168 hour
(SR); CHO-TP-57
<= 0.0020 ohm

@Temperature 85.0 °C,
Time 605000 sec
<= 0.0020 ohm

@Temperature 185 °F,
Time 168 hour
(TR); CHO-TP-57
<= 0.0020 ohm

@Temperature 121 °C,
Time 605000 sec
<= 0.0020 ohm

@Temperature 250 °F,
Time 168 hour
(SR); CHO-TP-57
<= 0.0020 ohm

@Temperature 121 °C,
Time 605000 sec
<= 0.0020 ohm

@Temperature 250 °F,
Time 168 hour
(TR); CHO-TP-57
<= 0.0020 ohm

@Time 605000 sec
<= 0.0020 ohm

@Time 168 hour
Salt fog corrosion; (SR); CHO-TP-57
<= 0.0020 ohm

@Time 605000 sec
<= 0.0020 ohm

@Time 168 hour
Salt fog corrosion; (TR); CHO-TP-57
Surface Resistivity per Square <= 0.0030 ohm
<= 0.0030 ohm
[ohm/in<sup>2<sup>]; <.0005 ohm/cm<sup>2</sup>; MIL-STD-202C
Descriptive Properties Value Comments
Adhesion to Aluminum >40 oz./inch
ASTM D1000
Adhesive Type Electrically Conductive, Pressure-Sensitive Acrylic
Flame Resistance (UL Subject 510) Pass
Foil/Fabric Type 1 oz. Tin-Plated Copper
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