Parker Chomerics CHO-SHRINK® Boots Conductive Heat Shrinkable EMI Shielding

Description: CHO-SHRINK connector boots provide EMI shielding, cable shield grounding, and strain relief at connector backshell terminations. A highly conductive silver-based coating applied to the inside surface of these molded polyolefin boots provides 60-80 dB attenuation above 500 MHz and in combination with braid will provide levels of attenuation exceeding 80 dB above 10 GHz. CHO-SHRINK boots shrink to a wide range of cable diameters (shrink ratio is 4:1 at the cable end), and offer a 40-65% weight savings compared to metal EMI adapters. They can be supplied with a conductive hot melt adhesive/sealant applied to each end. Normal shrink temperatures assure good joining and sealing at boot/connector interfaces. To specify hot-melt option, see table foot-notes. For optimum mechanical strength, CHO-SHRINK lipped boots should be shrunk over shrink boot adapters which provide a knurled and grooved surface. In addition, plastic tie-wraps should be installed over both ends of boot after shrinking. CHO-SHRINK cable transitions, including T, Y and other custom shapes, are also available.Information provided by Chomerics