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Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
P & P Technology EC-H Silver Copper Loaded Fluorosilicone
P & P Technology material reference EC-H is a printing grade fluorosilicone elastomer with a Silver/Copper conductive filler and is green in color. The material is specially compounded to offer exc..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics CHO-BOND 1026 Conductive Silicone Splicing Compound
Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silic..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Flex TR10; ASTM D1329
Parker Chomerics CHO-SEAL 1287 Conductive Elastomer
Conductive Fluorosilicone EMI/EMP Gasket. This material is silver-plated-aluminum-filled fluorosilicone elastomer which provides pressure and environmental sealing as well as high levels of EMI shie..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Cured
Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive
Description: TECKBOND-A conductive system is a silicone based, two-component RTV, filled with silver-plated aluminum particles. After cure, the resultant bond or seal is flexible, resilient, and con..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
dry
ITW Devcon Metal Welderâ„¢ Methacrylate Adhesive II, Grey / Beads
Information provided by ITW Devcon
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
dry
ITW Devcon Plastic Welderâ„¢ Methacrylate Adhesive, Straw, White, Black
Information provided by ITW Devcon
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Tra-Con Tra-Bond F175T One-Part Thixotropic UV Curing Adhesive
TRA-BOND F175T is a thixotropic, one part UV curing adhesive designed for bonding metals, ceramics and most rigid polymers. It is an excellent adhesive for fiber optic terminations where fast cure w..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy
Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive
Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy
Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® ED1021 Epoxy
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy
Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy
Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy
Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy
Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® OE138 Two Component Epoxy
Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® OG178 UV Cure Optical Epoxy
Material Description: A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive
EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Aremco Aremco-Bond™ 2310 High Performance Epoxide
Ceramic-Filled, 1:1, High Lap Shear and Peel Strength, Autoclavable.
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Aremco Aremco-Bond™ 807 High Performance Epoxide
10 Minute Set, Non-Sagging, 1:1, Excellent Electrical & Mechanical Properties
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