Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Thermal Properties Metric English Comments
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Recommended use; SAE J-2236
Rogers Corporation Bisco™ BF-1000 Cellular Silicone Foam
Soft, low compression set silicone foam often specified to meet safely-conscious requirements. UL recognized for flame retardance.Applications: Low closure-force gaskets and seals, Vibration and sh..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
NextGen Adhesives G907-24 Structural Epoxy Adhesive
Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics CHO-BOND 1026 Conductive Silicone Splicing Compound
Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silic..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Cured
Parker Chomerics Tecknit® 73-00008 Electrically Conductive Acrylic and Polyurethane Paint
Description: TECKNIT manufactures a highly conductive acrylic and polyurethane paints filled with silver. These coatings provide a cost effective method for shielding and grounding plastic enclosure..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics Tecknit Consil®-R 855 Pure Silver-Filled Silicone Elastomer
Description: CONSIL-RHT 855 is a pure silver-filled silicone elastomer ideal for applications where high temperature is a concernTypical Applications: CONSIL-RHT 855 silicone is used throughout indu..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Acrylic
Parker Chomerics Tecknit Teckshield®-F 100 OPI 0.0022" Diameter Wire, High Performance EMC Window
Description: TECKSHIELD-F high-performance fully laminated flat windows are specially designed to provide optimum optical transmission and EMI shielding in severe interference environments. TECKSHIE..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Natural Rubber, Vulcanized (NR, IR, Polyisoprene)
Natural rubber is polyisoprene. Chemical and environmental resistance and mechanical properties are improved through crosslinking (vulcanizing), usually through treatment with sulfur.Natural rubber..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
dry
ITW Devcon Metal Welderâ„¢ Methacrylate Adhesive, Grey / Beads
Information provided by ITW Devcon
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
ITW Plexus Plexusâ„¢ MA422 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive, medium open time.Information provided by Illinois Tool Works.
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Momentive Performance Materials TSE399 One Component RTV Adhesive Sealant/Coating, Clear/White/Black
TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTV’s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy
Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy
Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy
Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy
Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® B9021 Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy
Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive
Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® MA-5 Optical Grade Epoxy
Material Description: A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed through in..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy
Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H37-MPT Epoxy
Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel
QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
ACC QLE 1100 QSI Quantum Silicones 43 Durometer Clear, Addition Cure, 1-part Elastomer for Coating
QLE 1100 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Aremco Aremco-Bond™ 2320 High Performance Epoxide
Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
ITW Plexus Plexus™ MA922 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, medium open time.Information provided by Illinois Tool Works.
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Dow Corning 3112 RTV SILICONE RUBBER
Moldmaking RTV Rubber; Potting and encapsulating of electrical/electronic productsInformation provided by Dow Corning
Copyright © lookpolymers.com All Rights Reserved