Thermal Properties | Metric | English | Comments |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Recommended use; SAE J-2236 |
Rogers Corporation Bisco™ BF-1000 Cellular Silicone Foam Soft, low compression set silicone foam often specified to meet safely-conscious requirements. UL recognized for flame retardance.Applications: Low closure-force gaskets and seals, Vibration and sh.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and .. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
Parker Chomerics CHO-BOND 1026 Conductive Silicone Splicing Compound Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silic.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Cured |
Parker Chomerics Tecknit® 73-00008 Electrically Conductive Acrylic and Polyurethane Paint Description: TECKNIT manufactures a highly conductive acrylic and polyurethane paints filled with silver. These coatings provide a cost effective method for shielding and grounding plastic enclosure.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
Parker Chomerics Tecknit Consil®-R 855 Pure Silver-Filled Silicone Elastomer Description: CONSIL-RHT 855 is a pure silver-filled silicone elastomer ideal for applications where high temperature is a concernTypical Applications: CONSIL-RHT 855 silicone is used throughout indu.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Acrylic |
Parker Chomerics Tecknit Teckshield®-F 100 OPI 0.0022" Diameter Wire, High Performance EMC Window Description: TECKSHIELD-F high-performance fully laminated flat windows are specially designed to provide optimum optical transmission and EMI shielding in severe interference environments. TECKSHIE.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
Natural Rubber, Vulcanized (NR, IR, Polyisoprene) Natural rubber is polyisoprene. Chemical and environmental resistance and mechanical properties are improved through crosslinking (vulcanizing), usually through treatment with sulfur.Natural rubber.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | dry |
ITW Devcon Metal Welderâ„¢ Methacrylate Adhesive, Grey / Beads Information provided by ITW Devcon |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
ITW Plexus Plexusâ„¢ MA422 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive, medium open time.Information provided by Illinois Tool Works. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
Momentive Performance Materials TSE399 One Component RTV Adhesive Sealant/Coating, Clear/White/Black TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTV’s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® B9021 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application .. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® MA-5 Optical Grade Epoxy Material Description: A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed through in.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
ACC QLE 1100 QSI Quantum Silicones 43 Durometer Clear, Addition Cure, 1-part Elastomer for Coating QLE 1100 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat.. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
Aremco Aremco-Bond™ 2320 High Performance Epoxide Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
ITW Plexus Plexus™ MA922 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, medium open time.Information provided by Illinois Tool Works. |
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Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
Dow Corning 3112 RTV SILICONE RUBBER Moldmaking RTV Rubber; Potting and encapsulating of electrical/electronic productsInformation provided by Dow Corning |