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Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| P & P Technology EC-H Silver Copper Loaded Fluorosilicone P & P Technology material reference EC-H is a printing grade fluorosilicone elastomer with a Silver/Copper conductive filler and is green in color. The material is specially compounded to offer exc.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics CHO-BOND 1026 Conductive Silicone Splicing Compound Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silic.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Flex TR10; ASTM D1329 |
| Parker Chomerics CHO-SEAL 1287 Conductive Elastomer Conductive Fluorosilicone EMI/EMP Gasket. This material is silver-plated-aluminum-filled fluorosilicone elastomer which provides pressure and environmental sealing as well as high levels of EMI shie.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Cured |
| Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive Description: TECKBOND-A conductive system is a silicone based, two-component RTV, filled with silver-plated aluminum particles. After cure, the resultant bond or seal is flexible, resilient, and con.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | dry |
| ITW Devcon Metal Welderâ„¢ Methacrylate Adhesive II, Grey / Beads Information provided by ITW Devcon |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | dry |
| ITW Devcon Plastic Welderâ„¢ Methacrylate Adhesive, Straw, White, Black Information provided by ITW Devcon |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Tra-Con Tra-Bond F175T One-Part Thixotropic UV Curing Adhesive TRA-BOND F175T is a thixotropic, one part UV curing adhesive designed for bonding metals, ceramics and most rigid polymers. It is an excellent adhesive for fiber optic terminations where fast cure w.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® ED1021 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OG178 UV Cure Optical Epoxy Material Description: A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 2310 High Performance Epoxide Ceramic-Filled, 1:1, High Lap Shear and Peel Strength, Autoclavable. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 807 High Performance Epoxide 10 Minute Set, Non-Sagging, 1:1, Excellent Electrical & Mechanical Properties |
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